摘要: |
针对W波段毫米波雷达的应用需求,采用硅基微电机系统(Micro-electromechanical System,MEMS)异构集成技术研制了一款高集成度W波段相控阵瓦片式T/R组件。该组件将多个单片微波集成电路(Monolithic Microwave Integrated Circuits,MMIC)进行硅腔埋置,并将其与基片集成波导(Substrate Integrated Waveguide,SIW)结构的带通滤波器等无源结构进行一体化集成,设计了共面波导(Co-planar Waveguide,CPW)-SIW-CPW的射频穿墙结构,内部采用硅通孔(Through Silicon Via,TSV)实现互连。通过多层硅基板圆片级键合技术,组件最终实现了8层硅基堆叠的低损耗气密性封装。在装配完成后对该模块进行测试,在92~94 GHz内,饱和发射功率为29 dBm,单通道发射增益达到27 dB,接收增益为20 dB。该组件尺寸为9 mm×15 mm×1 mm,在4通道高密度集成的基础上实现了较高的性能,具有广阔的应用前景。 |
关键词: 相控阵雷达 瓦片式T/R组件 W波段 MMIC异构集成 硅基三维封装 |
DOI:10.20079/j.issn.1001-893x.240112005 |
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基金项目:国家自然科学基金资助项目(62231014) |
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Design of a W-band T /R Module with Silicon-based 3D Heterogeneous Integration Technology |
LIN Peng,GAO Yanhong,FENG Wenjie |
(1.State Key Laboratory of CEMEE,National University of Defense Technology,Changsha 410075,China;2.The 13th Research Institute of China Electronics Technology Group Corporation,Shijiazhuang 050051,China;3.School of Electronics and Information,South China University of Technology,Guangzhou 510641,China) |
Abstract: |
According to the application requirements of W-band millimeter-wave radar,a W-band active phase array tile-type T/R module is designed based on the silicon-based micro-electromechanical system(MEMS) 3D heterogeneous integration technology.Several microwave monolithic integrated circuits(MMIC) and the passive structure,such as band-pass filter with substrate integrated waveguide(SIW) are integrated.A radio frequency(RF) through-wall structure composed of co-planar waveguide(CPW)-SIW-CPW is designed,with interconnections realized internally by through silicon via(TSV) technology.The ㏕/R module is finally stacked in an eight-layer silicon-based package with low cost and hermetic by multilayer silicon wafer level bonding technology.The test results show that,in 92~94 GHz,the saturated transmitting power is 9 dBm,the transmit gain of each channel is no less than 27 dB,and the receive gain is no less than 20 dB.The module achieves high performance on the basis of high density integration of 4 channels,and has wide applied foreground. |
Key words: phased array tile-type T/R module W-band MMIC heterogeneous integrates silicon-based 3D package |