| 摘要: |
| 通过仿真分析和试验测试方法评估了通过板级传输方式替代射频电缆实现射频信号传
输的可行性，对宽带射频信号纳入微波多层板进行传输的关键技术进行了分析，包括大尺寸
、高机械强度背板的微波基材的选择，射频连接器的选择，复杂电磁环境下的路
间隔离度，传输链路阻抗平滑和连续，长距离射频传输线的插入损耗，以及宽带范围内如何
消除平面层自激等。 |
| 关键词: 综合化电子设备 射频多层背板 宽带射频信号 微带传输线 |
| DOI： |
|
| 基金项目: |
|
| Realization Feasibility Analysis of Wideband RF Backboard |
| HOU Hong-ying,YAN Hong |
| (Southwest China Institute of Electronic Technology, Chengdu 610036,China) |
| Abstract: |
| The feasibility of alternati
ng RF cable by wideband RF backboard to transmit RF signals is evaluated through
simulation and test.The
key techniques are analysed,including selection of large size and high mechani
ca
l strength PCB substrate，selection of RF connectors, the isolation between sign
als in complex electromag
netic environment,smooth and continuous of transmission impedance, low insertion
loss of long RF transmission line and elimination of self excitat
ion in planes. |
| Key words: integrated electronic device RF multilayer backboard wideband RF signals microstrip transm
ission line |
