| 摘要: |
| 本文介绍一种新的封装技术－微波多芯片组件（ＭＣＭ）技术。详细阐述了其设计环节并分析了设计要点，提出了通用的设计方法。此外还介绍了微波ＭＣＭ电路的制作流程。 |
| 关键词: 多芯片组件 封装 微波单片 IC 集成电路 |
| DOI：10.3969/j.issn.1001-893X. |
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| 基金项目: |
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| The Design and Manufacture of Microwave MCM Circuits |
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| Abstract: |
| In this paper a novel packaging technology, Microwave MCM, was introduced. We discussed the step and key points of its design and also proposed the design method. Besides this, the manufacture sequence was also showed in this paper. |
| Key words: Circuit and Device, Microwave MCM , Package , MMIC, |
