| 摘要: |
| 采用新型的在大气气氛中烧结的铜厚膜多层导电浆料,应用厚膜混合技术制作了2。2GHz和2.8GHz的环行器。其性能指标可与同类型采用薄膜贵金属制作的环行器相媲美,且工艺简单,成本低及生产周期短。 |
| 关键词: 微波集成电路,铜厚膜电路,环行器 |
| DOI： |
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| 基金项目: |
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| Development of copper thick film circulators |
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| Abstract: |
| using a new copper thick film pastc firing in the air, we made 2.2 GHz and 2.8GHz circulators by use of thick film hybrid technology. Their Performance targets may compare with those of similar circulators which are made from thin film noble metal. In doing so, technology is simple, the cost is low and producting time is short. |
| Key words: MIC,Copper Thick Film Circuit,CirCulators |
