| 摘要: |
| 针对电路模块的功能扩展带来的模块对外接口不足的问题，通过对分离式母板互联技术研究，确定了结构上分离的母板互联形式，主要对单方向分离互联母板互联设计、结构设计、印制板设计、可靠性设计等设计技术展开探讨，从一个角度解决了传统母板限制电路模块功能扩展带来的互联问题，实现了电路模块功能的有效扩展。 |
| 关键词: 电子设备 电路模板 分离式母板 互联设计 可靠性设计 |
| DOI： |
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| 基金项目: |
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| Interconnection design technology among single direction separated motherboards |
| ZHENG Da′an |
| () |
| Abstract: |
| For the problem of lack of external interface caused by function extension of circuit module,the interconnection technology of separated motherboards is researched and the interconnection structure form among separated motherboards is defined.The interconnection design,structural design,PCB design and reliability design are presented and interconnection problem resulted from function extension of circuit module on traditional motherboard is solved with the designed single direction separable motherboards.With the interconnection technology,the functions of circuit module are extended effectively. |
| Key words: electronic equipment circuit module separated motherboard interconnection design reliability design |
