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SOP集成技术的发展现状及其在毫米波系统中的应用
朱勇,张凯
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(中国西南电子技术研究所，成都 610036)

摘要:

介绍了SOP（SystemOnPackage）集成技术，并与传统系统集成方法以及SOC（SystemO n Chip）、MIP（ModuleInPackage）、MCM（MultiChipModule）、SIP（SystemI nPackage）等微封装、微集成技术进行了比较和分析，揭示了SOP小型化、低成本、高可靠性、高性能特点。对SOP在毫米波系统应用、新材料和新工艺的进展进行了总结，结果表明SOP在毫米波系统中具有良好的应用前景。

关键词: 毫米波集成技术 SOP 小型化综述

DOI：

基金项目:

Progress of SOP integration technology and its application in millimeter-wave systems

ZHU Yong,ZHANG Kai

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Abstract:

In this paper, SystemOnPackage(SOP) is introduced. SOP is compared with trad it ional system integration technology and other type s of integration technology, such as SystemOnChip(SOC),ModuleInPackage(M IP), MultiChipModule(MCM) and SystemInPackage(SIP).On this base,it is il lustrated that SOP is featured by miniaturization,l ow cost,high reliability and high performance. And the progress of SOP in millimeterwave system application,new material and n ew manufacture technology is analyzed. The results show that SOP has pr omising future in millimeterwave systems.

Key words: millimeter wave integration technology SOP miniaturization summarization