| 摘要: |
| 讨论了综合模块化航空电子系统中影响现场可更换模块（LRM）
封装的各个关键要素，重点分析了这些要素间的关联性，以及外部因素对模块封装的综合性
影响。同时，对国
内新一代飞机平台上的航空用LRM封装标准化提出了一些看法和建议。 |
| 关键词: 综合模块化航空电子 现场可更换模块 封装设计 综合影响 |
| DOI： |
|
| 基金项目: |
|
| Influences of Integrated Design Factors on Modular Packaging Design |
| CHENG Jin-jia |
| (Southwest China Institute of Electronic Technology,Chengdu 610036,China) |
| Abstract: |
| The detailed mechanical factors influencing the line replacement module(LRM) in
integrated modular avionics(IMA) are discussed,the inter-relationships between
these factors and the integrated influence of external factors on module packagi
ng are analysed,some views and suggestions about the packaging of the avionic LR
M for China′s new generation avionic system are given. |
| Key words: integrated modular avionics(IMA) line replacement modu
le(LRM) packaging design integrated influence |
