| 摘要: |
| 针对微波功能模块的结构和电路功能特点,采用多种具有一定熔点间隔的焊料,对微波功能模块的基板、I/O接头、壳体等进行软钎焊连接,替代螺接、铆接等连接形式,为产品的小型化、耐环境、高可靠提供实用的工艺手段。 |
| 关键词: 微波集成电路,温度阶梯焊,焊透率,大面积焊接 |
| DOI：10.3969/j.issn.1001-893X. |
| Received:July 25, 2007Revised:November 17, 2007 |
| 基金项目: |
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| Temperature Stepped Welding Technique for Microwave Function Modules |
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| Abstract: |
| In consideration of the structure and circuit functional character of microwave function modules,the circuit boards,I/O joints and shells of microwave function modules are connected by adopting the multi-melting point solders which can replace the connection form of bolting and riveting.This technique provides a practical method for the miniaturization,resistance to environment and high reliability of product. |
| Key words: microwave integration circuit(MIC),temperature stepped welding,complete welding speed,large-area welding |
