| 摘要: |
| 为满足差分过孔在高速PCB中低反射、高传输和阻抗稳定的设计要求，提出了短柱和非功能焊盘的优化设计方法，并给出了建模仿真与理论分析。采用HFSS软件对12层PCB中差分过孔进行三维建模与仿真，并使用ADS软件对仿真结果进行了眼图分析，结果表明：钻除短柱可以有效改善差分过孔的高频传输特性，其中信号反射的能量减少了79.1%，传输的能量增加了82.1%；移除非功能焊盘可以进一步改善差分过孔的高频特性，其中反射的能量减少了14.46%，传输的能量增加了14.13%。 |
| 关键词: 高速PCB 信号完整性 差分过孔 非功能焊盘 眼图 高频特性 |
| DOI： |
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| 基金项目:浙江省科技专项(2012C01037-1);嘉兴市科技项目(2011AZ1013);江苏省基础研究计划资助项目(BK2010137) |
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| Simulation analysis of differential via′s high frequency characteristics |
| ZHAO Ling-bao,CHEN Qing-hua |
| () |
| Abstract: |
| To satisfy the design requests of differential vias for multi-purpose, low reflectance, high transmission coefficient and impedance stabilization in high-speed PCB, an optimization design method for stub and non-function pads is proposed, and the model, simulation and theoretical analysis are provided.Three-dimensional differential vias in 12 layers PCB are modelled and simulated with HFSS, and the eye diagram is analyzed with ADS. The results shown that drilling out the stub can improve the high-frequency transmission characteristics of the differential via effectively, wherein the reflected energy reduces 79.1%, the transferred energy increases 82.1%; and removing the non-function pads can improve the high-frequency transmission characteristics of the differential via further, wherein the reflected energy reduces 14.46%, the transferred energy increases 14.13%. |
| Key words: high-speed PCB signal integrity differential via non-function pad eye diagram high frequency characteristics |
《电讯技术》编辑部 