| 摘要: |
| RapidIO背板的信号完整性优劣直接影响了RapidIO总线性能。结合行业规范，分解
出RapidIO背板信号完整性的相关指标要求，并推导出一套完整的背板测试方法，结合一个
典型的背板系统，对测试方法进行了详细的分析说明。该套测试方法切实可行，可直接应用
于类似的RapidIO背板测试。 |
| 关键词: RapidIO总线 背板 信号完整性 测试方法 |
| DOI： |
|
| 基金项目: |
|
| Signal Integrity Test Method for RapidIO Backplane |
| CAO Jin |
| (Southwest China Institute of Electronic Technology，Chengdu 610036,China) |
| Abstract: |
| The signal integrity (SI) problem of RapidIO backplane has direct effect on
the RapidIO bus performance. According to the industrial specification, this pa
per analyses the related SI performance requirement for the RapidIO backplan
e and introduces an integrated test method which is demonstrated particularly fo
r a typical backplane system. The test method is feasible and can be applied to
the similar RapidIO backplane test. |
| Key words: RapidIO bus backplane signal integrity test method |
《电讯技术》编辑部 