| 摘要: |
| 随着电子设备的小型化和高功率密度的发展，传统板级封装的隔离DC/DC变换器面临体积较大、散热效率低、集成度不足等瓶颈。针对传统封装工艺的局限性，提出了一种双层堆叠的系统级封装方案，利用再布线层技术，通过多次塑封、研磨等方法，将控制芯片、功率芯片、磁性元件等关键器件集成，形成双层堆叠结构。试验样品测试结果表明，封装尺寸仅为7 mm×7 mm×5.09 mm，功率密度达到328 W/in3(1 in≈2.54 cm)。相较于传统双层板级封装尺寸（12.7 mm×12.7 mm×10.8 mm），封装面积缩小了69.6%，体积缩小了85.7%，功率密度提高了近6倍，满载效率最高可达82.9%。该方案为实现隔离DC/DC变换器小型化集成提供了一种解决思路。 |
| 关键词: 隔离DC/DC变换器 双层堆叠 SIP封装 |
| DOI：10.20079/j.issn.1001-893x.250530003 |
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| 基金项目: |
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| Application of Dual-layer Stacked SIP Packaging Technology in Isolated DC/DC Power Converters |
| WANG Yubao,SONG Yixiong |
| (Chengdu Spaceon Electronics Co.,Ltd.,Chengdu 610036,China) |
| Abstract: |
| With the development of miniaturization and high power density of electronic devices,traditional board-level packaged isolated DC/DC converters face bottlenecks such as large size,low heat dissipation efficiency and insufficient integration.For the limitations of traditional packaging processes,a double-layer stacked system-in-package(SIP) scheme is proposed.By utilizing redistribution layer technology,key components such as control chips,power chips,and magnetic components are integrated.Through multiple molding,grinding,and other methods,a double-layer stacked structure is formed.Test results of the prototype show that the package size is only 7 mm×7 mm×5.09 mm,and the power density reaches 328 W/in3(1 in≈2.54 cm).Compared with the dimensions of the traditional double-layer board-level package(12.7 mm×12.7 mm×10.8 mm),the package area is reduced by 69.6%,the size reduced is by 85.7%,and the power density is increased by nearly 6 times,with a maximum full-load efficiency of up to 82.9%.This scheme provides a solution for achieving the miniaturization and integration of isolated DC/DC converters. |
| Key words: isolated DC/DC converter dual-layer stacking SIP packaging |
《电讯技术》编辑部 