| 摘要: |
| 针对航空用片式电阻器在含硫环境中因硫化失效（阻值漂移/开路）导致的航电系统可靠性风险，通过研究揭示了失效的底层机制：玻璃保护层与正面电极结合缺陷使内部银电极暴露，与硫化物反应生成高阻态Ag2S物质。通过失效分析和工艺溯源，明确生产过程中的不当机械应力损伤（如编带环节的立片/斜片）是造成保护层破裂的关键诱因。基于此，提出系统化解决方案，包括电阻制造过程工艺优化、电阻抗硫化设计、封装工艺优化和含硫材料管控。通过上述综合措施的实施并结合加速硫化试验证明，该策略可有效阻断硫侵蚀通道，提升电阻器可靠性。相关研究为航电系统抗硫化失效提供了可落地的工艺控制路径。 |
| 关键词: 航电系统 片式电阻器 硫化失效 应力损坏 工艺控制 |
| DOI：10.20079/j.issn.1001-893x.250530004 |
|
| 基金项目: |
|
| Process Control of Sulfurization Failure of Chip Resistors for Aviation |
| WANG Yubao,GOU Wenzhe,HUANG Guoping,WANG Xiaowei |
| (1. Chengdu Spaceon Electronics Co.,Ltd.,Chengdu 610036,China;2.Shenzhen Zhenhua Microelectronics Co.,Ltd.,Shenzhen 518000,China;3.Shenzhen Institute for Advanced Study,Uiversity of Electronic Science and Technology,Shenzhen 518000,China) |
| Abstract: |
| To address the reliability risks of avionics systems caused by sulfurization failure(resistance drift/open circuit) of aviation chip resistors in sulfur-containing environments,the underlying failure mechanism is revealed through study,that is,defects at the interface between the glass protective layer and the front electrode expose the internal silver electrode,enabling reaction with sulfides to form high-resistance Ag2S. Through failure analysis and process traceability,improper mechanical stress damage during production(misaligned/tilted positioning during tape packaging) is identified as the key inducer of protective layer cracking. According to these findings,a systematic solution is proposed,including optimization of resistor manufacturing,anti-sulfurization design,encapsulation process upgrade and full-process control of sulfur-containing materials. Accelerated sulfurization tests verify that this strategy effectively blocks sulfur ingress channels and significantly enhances the resistor reliability. The research provides actionable process control solutions for mitigating sulfurization failure in avionics systems. |
| Key words: avionics system chip resistor sulfurization failure mechanical stress damage manufacturing process control |
《电讯技术》编辑部 