| 摘要: |
| 基于微波多层板技术，通过对单片微波集成电路（MMIC）、微机电系统（MEMS）和低温共烧陶瓷（LTCC）滤波器等微组装工艺的优化和分析，使多通道接收前端进一步实现小型化设计和应用。同时，对电路和结构进行改进，使前端组件具有更好的幅相一致性和高隔离度。最终实现的C频段四通道接收前端尺寸为120 mm×50 mm×12 mm，幅相一致性分别小于±0.8 dB和±5°，通道间隔离度高于60 dBc。该设计方法的实现为小型化多通道接收前端的工程化应用提供了一种有效的解决方案。 |
| 关键词: 相控阵雷达 多通道接收前端 C频段 微组装 微波多层板 小型化设计 |
| DOI： |
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| 基金项目: |
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| Design of a miniaturized multi-channel receiver front-end based on microwave multilayer |
| BAI Rui,GAO Chang-zheng |
| () |
| Abstract: |
| Based on microwave multilayer boards technology,a further miniaturized multi-channel receiver front-end is designed and successfully developed after optimization for micro-assembly process of monolithic microwave integrated circuit(MMIC),micro-electro-mechanical system(MEMS) and low temperature cofired ceramic(LTCC) filters.Circuit and structure are improved in this design to obtain higher amplitude-phase consistency and isolation in receiver front-end.Finally the size of the C-band four-channel receiver front-end is only 120 mm×50 mm×12 mm,amplitude and phase consistencies are better than ±0.8 dB and ±5°,the isolation between channels is better than 60 dBc.The proposed design method provides an effctive solution for engineering application of miniaturized multi-channel receiver front-end. |
| Key words: phased array radar multi-channel receiver front-end C-band micro-assembly microwave multilayer board miniaturized design |
《电讯技术》编辑部 