| 摘要: |
| 研制了一种小体积的S频段射频收发系统级封装(SIP)模块，内部集成了基于多种工艺的器件。模块接收通道一次变频，发射通道二次变频，内部集成中频和射频本振信号源。模块采用双腔结构，不同腔体之间通过绝缘子进行垂直互连，大大减小了模块体积，模块体积为40 mm×40 mm×10 mm。模块采用正向设计，其主要指标的测试结果为：接收通道动态范围-100~-40 dBm，输出信号0~2 dBm，噪声系数小于等于2.8 dB，带外抑制大于等于50 dBc；发射通道输出信号大于等于2 dBm，二次、三次谐波抑制大于等于60 dBc，杂波抑制大于等于55 dBc，相位噪声在1 kHz和10 kHz处分别小于等于-82 dBc/Hz和-91 dBc/Hz。实测结果与仿真结果基本一致。 |
| 关键词: S频段 射频收发系统 系统级封装 本振信号源 垂直互连结构 |
| DOI： |
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| 基金项目: |
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| Development of an S-band RF transceiver module with system in package technology |
| WU Hongyu,LI Zhiqiang,WANG Jiangtao |
| () |
| Abstract: |
| A miniaturized S-band radio frequency(RF) transceiver module is designed by using system in package(SIP) technology.The module integrates devices based on a variety of process. Receiving channel is realized by single-conversion,transmitting channel is realized by double-conversion,and the intermediate frequency(IF) and RF local oscillator(LO) signal source is integrated internally. Double-cavity structure is used and different cavities are vertically interconnected through the insulator to reduce the module size largely. The size of module is 40 mm×40 mm×10 mm.Forward design is used and the measured main technical specifications of the module are:receiving channel dynamic range -100~-40 dBm,output signal 0~2 dBm,noise figure≤2.8 dB,out-band rejection≥50 dBc; transmitting channel output signal≥2 dBm,second and third harmonic suppression≥60 dBc，clutter rejection≥55 dBc,phase noise≤-82 dBc/Hz@1 kHz,≤-91 dBc/Hz@10 kHz.The measured results are basically agree with the simulation results. |
| Key words: S-band RF transceiver system system in package local oscillator signal source vertical interconnection structure |
《电讯技术》编辑部 