| 摘要: |
| 阐述了毫米波系统级封装（SOP）架构中基板功能化的概念、作用及实现方法。提出了利用低温共烧陶瓷（LTCC）技术，在SOP多层陶瓷基板中一体化集成多种无源电路单元，使封装基板在作为表面贴装有源芯片载体的同时，自身具备相应的无源射频功能。最终通过设计实例的仿真、加工及测试对比，验证了在SOP架构下实现封装基板功能化的可行性，及其所具有的良好的射频滤波、层间信号互联、射频接口过渡等电气性能。 |
| 关键词: 毫米波组件 系统级封装 低温共烧陶瓷 基板功能化 |
| DOI： |
|
| 基金项目: |
|
| Realization of substrate functionalization in millimeter-wave system on package |
| ZHANG Kai |
| () |
| Abstract: |
| The concept, function and realization of substrate functionalization in millimeter -wave(MMW) system on package(SOP) are presented in this paper. By using Low Temperature Co-fired Ceramic(LTCC) technology, multiple MMW passive circuit cells are incorporated into multi-layer ceramic substrate to make the substrate which is taken as the carrier of surface-mounted active chips have corresponding passive RF function by itself. Finally,comparison among simulation and measurement proves the feasibility of functional substrate, and good performance related to RF filtering, multilayer signal interconnection and RF connection-port transition. |
| Key words: millimeter-wave module SOP LTCC substrate functionalization |
《电讯技术》编辑部 