摘要: |
介绍了SOP(SystemOnPackage)集成技术,并与传统系统集成方法以及SOC(SystemO
n
Chip)、MIP(ModuleInPackage)、MCM(MultiChipModule)、SIP(SystemI
nPackage)
等微封装、微集成技术进行了比较和分析,揭示了SOP小型化、低成本、高可靠性、高性能
特点。对SOP在毫米波系统应用、新材料和新工艺的进展进行了总结,结果表明SOP在毫米波
系统中具有良好的应用前景。 |
关键词: 毫米波 集成技术 SOP 小型化 综述 |
DOI: |
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基金项目: |
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Progress of SOP integration technology and its application in millimeter-wave systems |
ZHU Yong,ZHANG Kai |
() |
Abstract: |
In this paper, SystemOnPackage(SOP) is introduced. SOP is compared with trad
it
ional system integration technology and other type
s of integration technology, such as SystemOnChip(SOC),ModuleInPackage(M
IP), MultiChipModule(MCM) and SystemInPackage(SIP).On this base,it is il
lustrated that SOP is featured by miniaturization,l
ow cost,high reliability and high performance.
And the progress of SOP in millimeterwave system application,new material and
n
ew manufacture technology is analyzed. The results show that SOP has pr
omising future in millimeterwave systems. |
Key words: millimeter wave integration technology SOP miniaturization summarization |