| 摘要: |
| 介绍了一种新颖的Ka频段T/R组件立体混合集成封装。针对Ka频
段T/R组件高频率和高密度的特点，提出了一种新颖的多层组装和双面密封的立体电路结构
，采用软基片、FR-4等简单成熟工艺，实现了Ka频段M-MCM的混合集成。该封装具有集成度
高、散热性好和可靠性高等特点，能够应用于Ka频段二维有源相控阵T/R子阵的工程研制。 |
| 关键词: Ka频段 有源相控阵 T/R组件 立体混合集成封装 |
| DOI： |
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| 基金项目: |
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| A novel 3D compound-integrated packaging of Ka-band T/R module |
| HE Yi-long |
| () |
| Abstract: |
| A 3D compound-integrated packaging of Ka-band T/R module is described in this pa
per.According to the high frequency and high density features of the Ka-band T/R
module, a novel multilayer-assembled and double-sided-sealing 3D circuit-struct
ure is provided.By adopting some simple manufacturing methods such as soft-subst
rate and FR-4, the compound-integrated Ka-band Multifunction Multi-chip Module(M
-MCM) is realized. The packaging is featured by high integration,good heat dissi
pation and high reliability and can be applied in the engineering development of
the Ka-band Adaptive Phase Array Radar (APAR) T/R subarray. |
| Key words: Ka-band adaptive phase array radar T/R module 3D com
pound-integrated packaging |
《电讯技术》编辑部 