| 摘要: |
| 通过对板级立体组装凸点互联焊盘设计技术的研究,找到了凸点焊盘设计的一种可靠的理论途径,很好地解决了凸点互联中对位精度控制的问题,实现了板级立体组装的凸点互联工艺技术。 |
| 关键词: 立体组装,凸点互联,焊点形态 |
| DOI：10.3969/j.issn.1001-893X. |
| 修订日期：2007-11-19 |
| 基金项目: |
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| PCB-based 3D Assembly Bump Interconnect Technology |
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| () |
| Abstract: |
| A reliable theoretic approach for bump pad design is discovered by studying bump interconnect pad design technology of 3D PCB assembly.It can effectively solve the problem of precision control in bump interconnect,and implement bump interconnect technology of 3D PCB assembly. |
| Key words: 3D assembly,bump interconnect,solder shape |
《电讯技术》编辑部 