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引用本文：

谢明华,郑大安,郑国洪.板级立体组装侧板垂直互联技术[J].电讯技术，2007，47（5）：174 - 176. [点击复制]
.Side Vertical Inter-connected Technology of PCB-based 3D Assembly[J].，2007，47（5）：174 - 176. [点击复制]

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板级立体组装侧板垂直互联技术

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摘要:

通过对板级立体组装的侧板垂直互联技术进行研究,找到了板级垂直互联的一种可靠的理论途径,很好地解决了板间垂直互联的问题,实现了板级立体组装的侧板垂直互联工艺技术.

关键词: 武器平台立体组装侧板垂直互联焊点形态

DOI：10.3969/j.issn.1001-893X.

修订日期：2007-07-19

基金项目:

Side Vertical Inter-connected Technology of PCB-based 3D Assembly

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Abstract:

By the research on the side vertical inter-connected technology of 3D assemble based on PCB,a reliable theoretic approach about PCB vertical inter-connected is found to solve vertical inter-connect problems between boards.Side vertical inter-connected process technology of 3D assembly based on PCB is achieved.

Key words: weapon platform,3D assembly,side vertical inter-connected,solder joint shape