| 摘要: |
| 讨论了高速PCB设计中涉及的定时、反射、串扰、振铃等信号完整性（SI）问题，结合CADENCE公司提供的高速PCB设计工具Specctraquest和Sigxp，对一采样率为125 MHz的AD／DAC印制板进行了仿真和分析，根据布线前和布线后的仿真结果设置适当的约束条件来控制高速PCB的布局布线，从各个环节上保证高速电路的信号完整性。 |
| 关键词: 高速PCB 信号完整性 EDA工具 仿真 分析 |
| DOI：10.3969/j.issn.1001-893X. |
| 投稿时间：2005-09-11修订日期：2006-01-20 |
| 基金项目:国防预研基金 |
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| Simulation and Analysis of Signal Integrity(SI) in High Speed PCB Design |
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| Abstract: |
| Such signal integrity(SI) issue as timing,reflection,crosstalk,ringing in high speed PCB design is discussed.The simulation and analysis of a PCB of AD/DAC module with the sampling rate of 125MHz are given by using SPECCTRAQuest and Sigxp from CADENCE.The placement and routing in high speed PCB are controled by proper constraints according to the result of pre-route and post-route simulation.The signal integrity of high speed circuit is assured in all steps. |
| Key words: high speed PCB,signal integrity(SI),EDA tool,simulation,analysis, |
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