| 摘要: |
| 从无铅组装的角度出发,详细分析了无铅组装技术涉及的无铅焊料和导电胶组装技术,阐述了传统的锡铅焊接与无铅焊接的工艺差异,提出了该技术要推广应用所面临的技术难点。 |
| 关键词: 无铅组装 无铅焊料 导电胶 |
| DOI：10.3969/j.issn.1001-893X. |
| 投稿时间：2004-11-19 |
| 基金项目: |
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| Preliminary Discussion on Lead-free Packaging Technology |
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| Abstract: |
| Lead-free solder and conducting resin packaging technology involved in lead-free packaging are analyzed.The technological differences between the traditional tin-lead welding and lead-free welding are also described.Finally, some technical difficulties in promoting lead-free packaging technology are presented. |
| Key words: Lead-free packaging,Lead-free solder,Conducting resin |
《电讯技术》编辑部 