| 摘要: |
| 先进加工设备进入印制板加工行业，促进了工艺变革。一台UV激光多功能微线钻的快速加工能力已与中小规模印制板厂能力相仿。应用新的工艺设备，可大大简化工艺流程，实现HDI(高密度互连印制板)加工向高精度、快速化发展。 |
| 关键词: UV激光微线钻 HDI 高密度互连印制板 工艺流程 电镀 金属化 |
| DOI：10.3969/j.issn.1001-893X. |
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| 基金项目: |
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| Fast HDI Processing Technology |
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| () |
| Abstract: |
| The advanced manufacturing equipment's entering into the manufacturing industry of printed circuit board has accelerated the change of process. Now a multi-purpose laser "microline drill" equipment with finish machining ability is similar to a factory with medium machining ability. Since new technology equipment is applied to produce HDI, the technologic flow has been simplified. The high density interlinked printed circuit board process with high accurate and celerity had been realized. |
| Key words: PCB,Fast HDI technology,UV Laser "microline drill, |
《电讯技术》编辑部 