| 摘要: |
| 随着科学技术的飞速发展，电子器件封装的小型化技术也得到很大的提高，元器件的组装密度越来越高。IC封装向着集成化、高性能化、多引线、面阵列端子型封装和裸芯片组装方向发展，这已经远远超出传统电路的SMT组装技术。本文着重从BGA器件的封装形式、再流焊技术以及检测三方面进行详细讨论。 |
| 关键词: BGA 再流焊技术 电子器件 表面贴装型封装 IC封装 |
| DOI：10.3969/j.issn.1001-893X. |
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| Reflow Solder Technology for BGA |
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| Abstract: |
| With the fast development of technology,the miniaturization technology of encapsulation of electronic part of an apparatus has been improved greatlly,and the assembly density is becoming higher and higher.IC encapsulation is in direction to integration,high performance,multilead,face array extremity and nakedness COMS chip,which is far beyond the SMT assembly of traditional circuit?This paper discusses the encapsulation,reflow solder technology and check for BGA. |
| Key words: Electronic device,BGA,Encapsulation,Reflow solder, |
《电讯技术》编辑部 