| 摘要: |
| 本文对波峰自动焊接中印制板的焊盘、焊盘孔、印制导线及其形状、尺寸以及分布等设计指标和参数作了较详细的分析.同时对印制电路板焊后清洗工艺中清洗剂的选择和清洗步骤作了简介. |
| 关键词: 印制版 焊接 设计 清洗 工艺 |
| DOI： |
|
| 基金项目: |
|
| Design of auto-soldered PCB and cleaning technology |
|
| () |
| Abstract: |
| This paper analyzes design targets and parameters of pad, pad hole, PC wire, shape, size and arrangement in automatic wavecrest soldering of PCB in detail. At the same time the selection or cleaner and the steps of cleaning of PCB after the soldering the deseribed simply. |
| Key words: Electronic Technology,Design of PCB,Cleanig Technology |
《电讯技术》编辑部 