| 摘要: |
| 本文较系统地介绍了印制电路板波峰焊接的焊前处理,焊接材料的选用与配制,焊接设备的设计与改进,焊接工艺规范参数的选择与调整。 |
| 关键词: 印制电路板 波峰焊接 焊接 |
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| Abstract: |
| This paper more systematically describes pre-soldering processing of wavecrest soldering on PCB, selection of bonding material and compounding, designof bonding equipments and improvement, selection of normlized parameters ofbonding technology and adjustment. |
| Key words: Electronic Technology,Wavecrest Soldering,PCB |
《电讯技术》编辑部 